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Proceedings Paper

3D MEMS sensor for application on earthquakes early detection and Nowcast
Author(s): Jerry Wu; Jing Liang; Harold Szu
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Paper Abstract

This paper presents a 3D Microelectromechanical systems (MEMS) sensor system to quickly and reliably identify the precursors that precede every earthquake. When a precursor is detected and is expected to be followed by a major earthquake, the sensor system will analyze and determine the magnitude of the earthquake. This newly proposed 3D MEMS sensor can provide P-waves, S-waves, and surface waves along with timing measurements to a data processing unit. The out coming data is processed and filtered continuously by a set of proposed built-in programmable Digital Signal Process (DSP) filters in order to remove noise and other disturbances and determine an earthquake pattern. Our goal is to reliably initiate an alarm before the arrival of the destructive waves. Keywords:

Paper Details

Date Published: 3 June 2016
PDF: 9 pages
Proc. SPIE 9871, Sensing and Analysis Technologies for Biomedical and Cognitive Applications 2016, 98710X (3 June 2016); doi: 10.1117/12.2239983
Show Author Affiliations
Jerry Wu, The George Washington Univ. (United States)
Jing Liang, The George Washington Univ. (United States)
Harold Szu, The Catholic Univ. of America (United States)


Published in SPIE Proceedings Vol. 9871:
Sensing and Analysis Technologies for Biomedical and Cognitive Applications 2016
Liyi Dai; Yufeng Zheng; Henry Chu; Anke D. Meyer-Bäse, Editor(s)

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