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Proceedings Paper

eBeam community speaks out on future directions for photomask manufacturing
Author(s): Aki Fujimura; Jan Willis
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Paper Abstract

As has been the case for many years and for the near future down to the 7-nm logic node, electron-beam (eBeam) mask writing is pushing the limits of acceptable write times and quality. The eBeam community has responded to these challenges through innovation, engineering and collaboration. In 2009, the eBeam Initiative was launched to provide a stronger voice and educational platform for eBeam technology within the photomask and semiconductor design and manufacturing ecosystem. For the fourth consecutive year, as the photomask community heads to the annual SPIE/BACUS Photomask Symposium in Monterey, the eBeam Initiative has conducted a survey on photomask-related trends and perceptions. This annual perceptions survey has been instrumental in confirming key areas to align the Initiative’s efforts on to guide the industry ecosystem forward in supporting the introduction of new eBeam technologies. At the request of the community, an additional mask survey was conducted this year by the eBeam Initiative to include trends on key mask metrics that help serve as a barometer for mask makers. The complete results of both surveys are available for download at Below is a summary and analysis of the key findings.

Paper Details

Date Published: 10 May 2016
PDF: 4 pages
Proc. SPIE 9984, Photomask Japan 2016: XXIII Symposium on Photomask and Next-Generation Lithography Mask Technology, 99840B (10 May 2016); doi: 10.1117/12.2239877
Show Author Affiliations
Aki Fujimura, D2S, Inc. (United States)
Jan Willis, eBeam Initiative (United States)

Published in SPIE Proceedings Vol. 9984:
Photomask Japan 2016: XXIII Symposium on Photomask and Next-Generation Lithography Mask Technology
Nobuyuki Yoshioka, Editor(s)

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