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Quality investigation of surface mount technology using phase-shifting digital holography
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Paper Abstract

Applying of a phase-shifting digital holography combined with compressive sensing to inspect the soldering quality of surface mount technology (SMT) which is a method for producing electronic circuits. In SMT, the components are mounted and connected with each other directly onto the surface of printed circuit boards (PCBs). By reconstructing the multidimensional images from a few samples of SMT, the results are solved by an optimization problem. In this paper, two problems have been concerned. The first one is to examine the devices and the soldering quality of connections between them, which are in micro-scaled. The second is to observe the effect of heat treatment of soldering material and devices on the surface mount board.

Paper Details

Date Published: 14 September 2016
PDF: 6 pages
Proc. SPIE 9970, Optics and Photonics for Information Processing X, 99700A (14 September 2016); doi: 10.1117/12.2237595
Show Author Affiliations
Chantira Boonsri, King Mongkut's Institute of Technology Ladkrabang (Thailand)
Prathan Buranasiri, King Mongkut's Institute of Technology Ladkrabang (Thailand)

Published in SPIE Proceedings Vol. 9970:
Optics and Photonics for Information Processing X
Khan M. Iftekharuddin; Abdul A. S. Awwal; Mireya García Vázquez; Andrés Márquez; Mohammad A. Matin, Editor(s)

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