Share Email Print
cover

Proceedings Paper

ISERM: in-situ etch rate measurement system
Author(s): S. Gürtler; M. Georges; C. Schikora
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The in-situ etch rate measurement system (ISERM) has not just been developed to bring the automation process of an IBF plant to the next level, but to add another possibility of control for the ion beam and therefore characterize the tool of the plant. Thus far a dummy sample must be used on which footprints and grooves must be generated by the ion beam tool. To determine the etch rate and the shape of the ion beam the sample needs to be measured with a surface interferometer afterward. This is a time intensive and static process and has to be redone in case of changing process parameters, e.g. ion source parameter settings. The ISERM is capable of automatically and repeatedly determining the etch rate and the shape of the ion beam without the need of processing a dummy sample.

Paper Details

Date Published: 30 June 2016
PDF: 5 pages
Proc. SPIE 10009, Third European Seminar on Precision Optics Manufacturing, 100090N (30 June 2016); doi: 10.1117/12.2236642
Show Author Affiliations
S. Gürtler, OPTEG GmbH (Germany)
M. Georges, OPTEG GmbH (Germany)
C. Schikora, OPTEG GmbH (Germany)


Published in SPIE Proceedings Vol. 10009:
Third European Seminar on Precision Optics Manufacturing
Rolf Rascher; Oliver Fähnle; Christine Wünsche; Christian Schopf, Editor(s)

© SPIE. Terms of Use
Back to Top