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Proceedings Paper

Analysis of transient thermal inspection
Author(s): Shek Keung Lau; Darryl P. Almond; Pravinkumar Mulji Patel; J. Corbett; M. B.C. Quigley
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Paper Abstract

Pulse-video thermographic images of well characterised sub-surface defects have been examined in detail using an image analyser. The dependence of the transient response on defect size and depth beneath the surface has been established empirically and investigated analytically. Close parallels are drawn with earlier observed thermal wave effects. The work provides an indication of the basic sensitivity of this transient thermal inspection technique.

Paper Details

Date Published: 1 October 1990
PDF: 8 pages
Proc. SPIE 1320, Infrared Technology and Applications, (1 October 1990); doi: 10.1117/12.22325
Show Author Affiliations
Shek Keung Lau, Univ. of Bath (United Kingdom)
Darryl P. Almond, Univ. of Bath (United Kingdom)
Pravinkumar Mulji Patel, Univ. of Bath (United Kingdom)
J. Corbett, Central Electricity Generating Board (United Kingdom)
M. B.C. Quigley, Central Electricity Generating Board (United Kingdom)

Published in SPIE Proceedings Vol. 1320:
Infrared Technology and Applications

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