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Proceedings Paper

Transmission laser bonding of low melting eutectic alloys
Author(s): C. Hoff; K. Cromwell; J. Hermsdorf; M. Akin; M. C. Wurz; S. Kaierle; H. J. Maier; L. Overmeyer
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Paper Abstract

Transparent polymers with low glass transition temperatures are flexible materials and can serve as an optical waveguide or as substrates for the layer structure in applications such as humidity or temperature sensors. The background of this publication is the development of a laser-based process to bond silicon chips, which serve as emitter or detector in an optical system, on a substrate, without exposing the substrate to thermo-mechanical stress. Using transmission laser bonding of low-melting eutectic alloys, the necessary energy can be coupled into the fusion zone precisely to reduce the process time. In this paper, Si-chips with 52In48Sn and 66In34Bi layers are investigated to bond on rigid substrates. Experimental results are presented, which illustrate the mechanical stability of these compounds.

Paper Details

Date Published: 24 March 2016
PDF: 8 pages
Proc. SPIE 9741, High-Power Laser Materials Processing: Lasers, Beam Delivery, Diagnostics, and Applications V, 97410K (24 March 2016); doi: 10.1117/12.2230399
Show Author Affiliations
C. Hoff, Laser Zentrum Hannover e.V. (Germany)
K. Cromwell, Laser Zentrum Hannover e.V. (Germany)
J. Hermsdorf, Laser Zentrum Hannover e.V. (Germany)
M. Akin, Leibniz Univ. Hannover (Germany)
M. C. Wurz, Leibniz Univ. Hannover (Germany)
S. Kaierle, Laser Zentrum Hannover e.V. (Germany)
H. J. Maier, Leibniz Univ. Hannover (Germany)
L. Overmeyer, Laser Zentrum Hannover e.V. (Germany)

Published in SPIE Proceedings Vol. 9741:
High-Power Laser Materials Processing: Lasers, Beam Delivery, Diagnostics, and Applications V
Friedhelm Dorsch; Stefan Kaierle, Editor(s)

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