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Proceedings Paper

Excursion detection using leveling data
Author(s): MinGyu Kim; Jaewuk Ju; Boris Habets; Georg Erley; Enrico Bellmann; Seop Kim
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Paper Abstract

Wafer leveling data are usually used inside the exposure tool for ensuring good focus, then discarded. This paper describes the implementation of a monitoring and analysis solution to download these data automatically, together with the correction profiles applied by the scanner. The resulting height maps and focus residuals form the basis for monitoring metrics tailored to catching tool and process drifts and excursions in a high-volume manufacturing (HVM) environment.

In this paper, we present four six cases to highlight the potential of the method: wafer edge monitoring, chuck drift monitoring, correlations between focus residuals and overlay errors, and pre-process monitoring by chuck fingerprint removal.

Paper Details

Date Published: 8 March 2016
PDF: 14 pages
Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97783O (8 March 2016); doi: 10.1117/12.2230389
Show Author Affiliations
MinGyu Kim, SK Hynix (Korea, Republic of)
Jaewuk Ju, SK Hynix (Korea, Republic of)
Boris Habets, Qoniac GmbH (Germany)
Georg Erley, Qoniac GmbH (Germany)
Enrico Bellmann, Qoniac GmbH (Germany)
Seop Kim, Qoniac Korea Co., Ltd. (Korea, Republic of)


Published in SPIE Proceedings Vol. 9778:
Metrology, Inspection, and Process Control for Microlithography XXX
Martha I. Sanchez, Editor(s)

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