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Proceedings Paper

Assembly of optical transceivers for board-level optical interconnects
Author(s): Krzysztof Nieweglowski; Karlheinz Bock
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Paper Abstract

This paper demonstrates an approach for passive alignment and assembly of link components for board-level very-short range optical interconnects. This interchip optical link is based on planar polymeric multimode waveguides and glassbased electro-optical transceivers. The main aim of the work is the investigation of assembly processes of link components in order to fulfill the tolerance requirements using passive alignment. The optical characterization in regard to the optical coupling between link components will define the tolerances for the alignment process. This optical analysis is based on measurements of spatial coupling characteristics. The influence of assembly tolerances on the coupling efficiency is investigated. Flip-chip assembly of electro-optical devices on the glass interposer and of the glass interposer on optical overlay is presented to prove the implementation of the concept.

Paper Details

Date Published: 27 April 2016
PDF: 10 pages
Proc. SPIE 9888, Micro-Optics 2016, 98880S (27 April 2016); doi: 10.1117/12.2227903
Show Author Affiliations
Krzysztof Nieweglowski, TU Dresden (Germany)
Karlheinz Bock, TU Dresden (Germany)

Published in SPIE Proceedings Vol. 9888:
Micro-Optics 2016
Hugo Thienpont; Jürgen Mohr; Hans Zappe; Hirochika Nakajima, Editor(s)

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