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Proceedings Paper

Photonic hybrid assembly through flexible waveguides
Author(s): K. Wörhoff; A. Prak; F. Postma; A. Leinse; K. Wu; T. J. Peters; M. Tichem; B. Amaning-Appiah; V. Renukappa; G. Vollrath; J. Balcells-Ventura; P. Uhlig; M. Seyfried; D. Rose; R. Santos; X. J. M. Leijtens; B. Flintham; M. Wale; D. Robbins
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Paper Abstract

Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I/O in InP PICs, even with waveguide spot size conversion. In a European research initiative – PHASTFlex - we develop and investigate an innovative, novel assembly concept, in which the waveguides in a matching TriPleX interposer PIC are released during fabrication to make them movable. After assembly of both chips by flip-chip bonding on a common carrier, TriPleX based actuators and clamping functions position and fix the flexible waveguides with the required accuracy.

Paper Details

Date Published: 13 May 2016
PDF: 8 pages
Proc. SPIE 9891, Silicon Photonics and Photonic Integrated Circuits V, 98911P (13 May 2016); doi: 10.1117/12.2227814
Show Author Affiliations
K. Wörhoff, LioniX BV (Netherlands)
A. Prak, LioniX BV (Netherlands)
F. Postma, LioniX BV (Netherlands)
A. Leinse, LioniX BV (Netherlands)
K. Wu, Technische Univ. Delft (Netherlands)
T. J. Peters, Technische Univ. Delft (Netherlands)
M. Tichem, Technische Univ. Delft (Netherlands)
B. Amaning-Appiah, Aifotec AG (Germany)
V. Renukappa, Aifotec AG (Germany)
G. Vollrath, Aifotec AG (Germany)
J. Balcells-Ventura, IMST GmbH (Germany)
P. Uhlig, IMST GmbH (Germany)
M. Seyfried, ficonTEC Service GmbH (Germany)
D. Rose, ficonTEC Service GmbH (Germany)
R. Santos, Technische Univ. Eindhoven (Netherlands)
X. J. M. Leijtens, Technische Univ. Eindhoven (Netherlands)
B. Flintham, Oclaro Technology, Inc. (United Kingdom)
M. Wale, Oclaro Technology, Inc. (United Kingdom)
D. Robbins, Willow Photonics, Ltd. (United Kingdom)


Published in SPIE Proceedings Vol. 9891:
Silicon Photonics and Photonic Integrated Circuits V
Laurent Vivien; Lorenzo Pavesi; Stefano Pelli, Editor(s)

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