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Proceedings Paper

Process optimization of single-coat positive photoresist for thick film applications
Author(s): Alan E. Kozlowski
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Paper Abstract

This paper reports on a single coat process optimization of a new positive thick film resist originally described by Renaldo et al. from IBM at SPIE in 1995. The positive diazonapthoquinone photoresist system, SJR-3000, can achieve uniform coatings of greater than 28 microns in a single coat. In addition the process can produce images with wall profiles greater than 80 degrees and is compatible with traditional etch baths as well as gold, copper and permalloy plating baths without exhibiting cracking. Process latitude over a wide range exposure and development conditions will be demonstrated at a 20 (mu) coating thickness using a stepper exposure system.

Paper Details

Date Published: 26 September 1995
PDF: 11 pages
Proc. SPIE 2640, Microlithography and Metrology in Micromachining, (26 September 1995); doi: 10.1117/12.222639
Show Author Affiliations
Alan E. Kozlowski, Shipley Co., Inc. (United States)


Published in SPIE Proceedings Vol. 2640:
Microlithography and Metrology in Micromachining
Michael T. Postek, Editor(s)

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