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Proceedings Paper

Overview of the miniaturization technologies
Author(s): Robert O'Neil Warrington
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Paper Abstract

This overview paper will cover the miniaturization technologies as applied to microelectromechanical systems (MEMS) or micromanufacturing. Technologies reviewed will include bulk and surface micromachining of silicon, the high-aspect ratio technologies including deep X-ray lithography (LIGA) and photo sensitive polyimide, and the complementary processes which include micro-drilling, milling, turning, and electrical discharge machining, laser based micromachining and focussed ion beam micromachining. Examples of each of the process technologies will be given and a capabilities comparison among the technologies will be presented. A historical comparison of MEMS with the vlsi industry will be made and the current status and market forecast for these technologies will be presented. A brief comparison of US research with current research in Japan and Europe will be made along with comments about the status of US research, including current research projects at the Institute for Micromanufacturing.

Paper Details

Date Published: 26 September 1995
PDF: 6 pages
Proc. SPIE 2640, Microlithography and Metrology in Micromachining, (26 September 1995); doi: 10.1117/12.222632
Show Author Affiliations
Robert O'Neil Warrington, Louisiana Tech Univ. (United States)


Published in SPIE Proceedings Vol. 2640:
Microlithography and Metrology in Micromachining
Michael T. Postek, Editor(s)

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