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Proceedings Paper

Fracture behavior of reinforced aluminum alloy matrix composites using thermal imaging tools
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Paper Abstract

In this work the influence of the microstructure at the vicinity of the interface on the fracture behavior of particulate-reinforced aluminum alloy matrix composites (Al/SiCp composites) is studied by using thermographic tools. In particular, infrared thermography was used to monitor the plane crack propagation behavior of the materials. The deformation of solid materials is almost always accompanied by heat release. When the material becomes deformed or is damaged and fractured, a part of the energy necessary to initiate and propagate the damage is transformed in an irreversible way into heat. The thermal camera detects the heat wave, generated by the thermo-mechanical coupling and the intrinsic dissipated energy during mechanical loading of the sample. By using an adapted detector, thermography records the two dimensional "temperature" field as it results from the infrared radiation emitted by the object. The principal advantage of infrared thermography is its noncontact, non-destructive character. This methodology is being applied to characterise the fracture behavior of the particulate composites. Infrared thermography is being used to monitor the plane crack propagation behavior of such materials. Furthermore, an innovative approach to use microscopic measurements using IR microscopic lenses was attempted, in order to enable smaller features (in the micro scale) to be imaged with accuracy and assurance.

Paper Details

Date Published: 11 May 2016
PDF: 11 pages
Proc. SPIE 9861, Thermosense: Thermal Infrared Applications XXXVIII, 98610K (11 May 2016); doi: 10.1117/12.2225511
Show Author Affiliations
N. P. Avdelidis, National Technical Univ. of Athens (Greece)
Univ. Laval (Canada)
D. Exarchos, Univ. of Ioannina (Greece)
P. Vazquez, Univ. de Reims Champagne - Ardenne (France)
C. Ibarra-Castanedo, Univ. Laval (Canada)
S. Sfarra, Univ. of L'Aquila (Italy)
X. P. V. Maldague, Univ. Laval (Canada)
T. E. Matikas, Univ. of Ioannina (Greece)


Published in SPIE Proceedings Vol. 9861:
Thermosense: Thermal Infrared Applications XXXVIII
Joseph N. Zalameda; Paolo Bison, Editor(s)

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