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Proceedings Paper

Extended SWIR imaging sensors for hyperspectral imaging applications
Author(s): A. Weber; M. Benecke; J. Wendler; A. Sieck; D. Hübner; H. Figgemeier; R. Breiter
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Paper Abstract

AIM has developed SWIR modules including FPAs based on liquid phase epitaxy (LPE) grown MCT usable in a wide range of hyperspectral imaging applications. Silicon read-out integrated circuits (ROIC) provide various integration and readout modes including specific functions for spectral imaging applications. An important advantage of MCT based detectors is the tunable band gap. The spectral sensitivity of MCT detectors can be engineered to cover the extended SWIR spectral region up to 2.5μm without compromising in performance. AIM developed the technology to extend the spectral sensitivity of its SWIR modules also into the VIS. This has been successfully demonstrated for 384x288 and 1024x256 FPAs with 24μm pitch. Results are presented in this paper. The FPAs are integrated into compact dewar cooler configurations using different types of coolers, like rotary coolers, AIM’s long life split linear cooler MCC030 or extreme long life SF100 Pulse Tube cooler. The SWIR modules include command and control electronics (CCE) which allow easy interfacing using a digital standard interface. The development status and performance results of AIM’s latest MCT SWIR modules suitable for hyperspectral systems and applications will be presented.

Paper Details

Date Published: 26 May 2016
PDF: 15 pages
Proc. SPIE 9854, Image Sensing Technologies: Materials, Devices, Systems, and Applications III, 98540C (26 May 2016); doi: 10.1117/12.2223737
Show Author Affiliations
A. Weber, AIM Infrarot-Module GmbH (Germany)
M. Benecke, AIM Infrarot-Module GmbH (Germany)
J. Wendler, AIM Infrarot-Module GmbH (Germany)
A. Sieck, AIM Infrarot-Module GmbH (Germany)
D. Hübner, AIM Infrarot-Module GmbH (Germany)
H. Figgemeier, AIM Infrarot-Module GmbH (Germany)
R. Breiter, AIM Infrarot-Module GmbH (Germany)


Published in SPIE Proceedings Vol. 9854:
Image Sensing Technologies: Materials, Devices, Systems, and Applications III
Nibir K. Dhar; Achyut K. Dutta, Editor(s)

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