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Proceedings Paper

In-process thermal imaging of the electron beam freeform fabrication process
Author(s): Karen M. Taminger; Christopher S. Domack; Joseph N. Zalameda; Brian L. Taminger; Robert A. Hafley; Eric R. Burke
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Paper Abstract

Researchers at NASA Langley Research Center have been developing the Electron Beam Freeform Fabrication (EBF3) metal additive manufacturing process for the past 15 years. In this process, an electron beam is used as a heat source to create a small molten pool on a substrate into which wire is fed. The electron beam and wire feed assembly are translated with respect to the substrate to follow a predetermined tool path. This process is repeated in a layer-wise fashion to fabricate metal structural components. In-process imaging has been integrated into the EBF3 system using a near-infrared (NIR) camera. The images are processed to provide thermal and spatial measurements that have been incorporated into a closed-loop control system to maintain consistent thermal conditions throughout the build. Other information in the thermal images is being used to assess quality in real time by detecting flaws in prior layers of the deposit. NIR camera incorporation into the system has improved the consistency of the deposited material and provides the potential for real-time flaw detection which, ultimately, could lead to the manufacture of better, more reliable components using this additive manufacturing process.

Paper Details

Date Published: 11 May 2016
PDF: 11 pages
Proc. SPIE 9861, Thermosense: Thermal Infrared Applications XXXVIII, 986102 (11 May 2016); doi: 10.1117/12.2222439
Show Author Affiliations
Karen M. Taminger, NASA Langley Research Ctr. (United States)
Christopher S. Domack, Analytical Mechanics Associates, Inc. (United States)
Joseph N. Zalameda, NASA Langley Research Ctr. (United States)
Brian L. Taminger, Analytical Mechanics Associates, Inc. (United States)
Robert A. Hafley, NASA Langley Research Ctr. (United States)
Eric R. Burke, NASA Langley Research Ctr. (United States)


Published in SPIE Proceedings Vol. 9861:
Thermosense: Thermal Infrared Applications XXXVIII
Joseph N. Zalameda; Paolo Bison, Editor(s)

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