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Proceedings Paper

Tin LPP plasma control in the argon cusp source
Author(s): Malcolm W. McGeoch
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Paper Abstract

The argon cusp plasma has been introduced [1,2] for 500W class tin LPP exhaust control in view of its high power handling, predicted low tin back-scatter from a beam dump, and avoidance of hydrogen usage. The physics of tin ion control by a plasma is first discussed. Experimentally, cusp stability and exhaust disc geometry have previously been proved at full scale [2], the equivalent of 300W-500W usable EUV. Here we verify operation of the plasma barrier that maintains a high argon density next to the collector, for its protection, and a low density in the long path toward the intermediate focus, for efficiency. A pressure differential of 2Pa has been demonstrated in initial work. Other aspects of tin LPP plasma control by the cusp have now been demonstrated using tin ions from a low Hz 130mJ CO2 laser pulse onto a solid tin surface at the cusp center. Plasma is rejected at the <0.5% level at the collector mirror location using the cusp magnetic field alone. Plasma also is rejected using a low argon density (<1x1014cm-3). We have measured the tin ion flow pattern toward the large area annular beam dump. Scaling of the cusp design to match a specified exhaust power is discussed. In view of this work, argon cusp exhaust control appears to be very promising for 500W class tin LPP sources.

Paper Details

Date Published: 18 March 2016
PDF: 8 pages
Proc. SPIE 9776, Extreme Ultraviolet (EUV) Lithography VII, 97760S (18 March 2016); doi: 10.1117/12.2222299
Show Author Affiliations
Malcolm W. McGeoch, PLEX LLC (United States)


Published in SPIE Proceedings Vol. 9776:
Extreme Ultraviolet (EUV) Lithography VII
Eric M. Panning, Editor(s)

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