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Proceedings Paper

Optimizing noise for defect analysis with through-focus scanning optical microscopy
Author(s): Ravikiran Attota; John Kramar
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Paper Abstract

Through-focus scanning optical microscopy (TSOM) shows promise for patterned defect analysis, but it is important to minimize total system noise. TSOM is a three-dimensional shape metrology method that can achieve sub-nanometer measurement sensitivity by analyzing sets of images acquired through-focus using a conventional optical microscope. Here we present a systematic noise-analysis study for optimizing data collection and data processing parameters for TSOM and then demonstrate how the optimized parameters affect defect analysis. We show that the best balance between signalto- noise performance and acquisition time can be achieved by judicious spatial averaging. Correct background-signal subtraction of the imaging-system inhomogeneities is also critical, as well as careful alignment of the constituent images used in differential TSOM analysis.

Paper Details

Date Published: 8 March 2016
PDF: 11 pages
Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 977811 (8 March 2016); doi: 10.1117/12.2220679
Show Author Affiliations
Ravikiran Attota, NIST (United States)
John Kramar, NIST (United States)


Published in SPIE Proceedings Vol. 9778:
Metrology, Inspection, and Process Control for Microlithography XXX
Martha I. Sanchez, Editor(s)

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