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Proceedings Paper

Hybrid enabled thin film metrology using XPS and optical
Author(s): Alok Vaid; Givantha Iddawela; Sridhar Mahendrakar; Michael Lenahan; Mainul Hossain; Padraig Timoney; Abner F. Bello; Cornel Bozdog; Heath Pois; Wei Ti Lee; Mark Klare; Michael Kwan; Byung Cheol Kang; Paul Isbester; Matthew Sendelbach; Naren Yellai; Prasad Dasari; Tom Larson
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Paper Abstract

Complexity of process steps integration and material systems for next-generation technology nodes is reaching unprecedented levels, the appetite for higher sampling rates is on the rise, while the process window continues to shrink. Current thickness metrology specifications reach as low as 0.1A for total error budget – breathing new life into an old paradigm with lower visibility for past few metrology nodes: accuracy. Furthermore, for advance nodes there is growing demand to measure film thickness and composition on devices/product instead of surrogate planar simpler pads. Here we extend our earlier work in Hybrid Metrology to the combination of X-Ray based reference technologies (high performance) with optical high volume manufacturing (HVM) workhorse metrology (high throughput). Our stated goal is: put more “eyes” on the wafer (higher sampling) and enable move to films on pattern structure (control what matters). Examples of 1X front-end applications are used to setup and validate the benefits.

Paper Details

Date Published: 24 March 2016
PDF: 11 pages
Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97780M (24 March 2016); doi: 10.1117/12.2220299
Show Author Affiliations
Alok Vaid, GLOBALFOUNDRIES, Inc. (United States)
Givantha Iddawela, GLOBALFOUNDRIES, Inc. (United States)
Sridhar Mahendrakar, GLOBALFOUNDRIES, Inc. (United States)
Michael Lenahan, GLOBALFOUNDRIES, Inc. (United States)
Mainul Hossain, GLOBALFOUNDRIES, Inc. (United States)
Padraig Timoney, GLOBALFOUNDRIES, Inc. (United States)
Abner F. Bello, GLOBALFOUNDRIES, Inc. (United States)
Cornel Bozdog, ReVera Inc. (United States)
Heath Pois, ReVera Inc. (United States)
Wei Ti Lee, ReVera Inc. (United States)
Mark Klare, ReVera Inc. (United States)
Michael Kwan, ReVera Inc. (United States)
Byung Cheol Kang, Nova Measuring Instruments, Inc. (United States)
Paul Isbester, Nova Measuring Instruments, Inc. (United States)
Matthew Sendelbach, Nova Measuring Instruments, Inc. (United States)
Naren Yellai, Nova Measuring Instruments, Inc. (United States)
Prasad Dasari, Nova Measuring Instruments, Inc. (United States)
Tom Larson, ReVera Inc. (United States)


Published in SPIE Proceedings Vol. 9778:
Metrology, Inspection, and Process Control for Microlithography XXX
Martha I. Sanchez, Editor(s)

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