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Proceedings Paper

Spin-on metal oxide materials with high etch selectivity and wet strippability
Author(s): Huirong Yao; Salem Mullen; Elizabeth Wolfer; Douglas McKenzie; Dalil Rahman; JoonYeon Cho; Munirathna Padmanaban; Claire Petermann; SungEun Hong; YoungJun Her
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Paper Abstract

Metal oxide or metal nitride films are used as hard mask materials in semiconductor industry for patterning purposes due to their excellent etch resistances against the plasma etches. Chemical vapor deposition (CVD) or atomic layer deposition (ALD) techniques are usually used to deposit the metal containing materials on substrates or underlying films, which uses specialized equipment and can lead to high cost-of-ownership and low throughput. We have reported novel spin-on coatings that provide simple and cost effective method to generate metal oxide films possessing good etch selectivity and can be removed by chemical agents. In this paper, new spin-on Al oxide and Zr oxide hard mask formulations are reported. The new metal oxide formulations provide higher metal content compared to previously reported material of specific metal oxides under similar processing conditions. These metal oxide films demonstrate ultra-high etch selectivity and good pattern transfer capability. The cured films can be removed by various chemical agents such as developer, solvents or wet etchants/strippers commonly used in the fab environment. With high metal MHM material as an underlayer, the pattern transfer process is simplified by reducing the number of layers in the stack and the size of the nano structure is minimized by replacement of a thicker film ACL. Therefore, these novel AZ® spinon metal oxide hard mask materials can potentially be used to replace any CVD or ALD metal, metal oxide, metal nitride or spin-on silicon-containing hard mask films in 193 nm or EUV process.

Paper Details

Date Published: 25 March 2016
PDF: 9 pages
Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 97791O (25 March 2016); doi: 10.1117/12.2220293
Show Author Affiliations
Huirong Yao, EMD Performance Material Corp. (United States)
Salem Mullen, EMD Performance Material Corp. (United States)
Elizabeth Wolfer, EMD Performance Material Corp. (United States)
Douglas McKenzie, EMD Performance Material Corp. (United States)
Dalil Rahman, EMD Performance Material Corp. (United States)
JoonYeon Cho, EMD Performance Material Corp. (United States)
Munirathna Padmanaban, EMD Performance Material Corp. (United States)
Claire Petermann, Merck Performance Materials (Belgium)
SungEun Hong, Merck Performance Materials (Belgium)
YoungJun Her, Merck Performance Materials Manufacturing G.K. (Japan)

Published in SPIE Proceedings Vol. 9779:
Advances in Patterning Materials and Processes XXXIII
Christoph K. Hohle; Rick Uchida, Editor(s)

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