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Proceedings Paper

Studies on laser material processing with nanosecond and sub-nanosecond and picosecond and sub-picosecond pulses
Author(s): Jie Zhang; Sha Tao; Brian Wang; Jay Zhao
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Paper Abstract

In this paper, laser ablation of widely used metal (Al, Cu. stainless-steel), semiconductor (Si), transparent material (glass, sapphire), ceramic (Al2O3, AlN) and polymer (PI, PMMA) in industry were systematically studied with pulse width from nanosecond (5-100ns), picosecond (6-10ps) to sub-picosecond (0.8-0.95ps). A critical damage zone (CDZ) of up to 100um with ns laser, ≤50um with ps laser, and ≤20um with sub-ps laser, respectively was observed as a criteria of selecting the laser pulse width. The effects of laser processing parameters on speed and efficiency were also investigated. This is to explore how to provide industry users the best laser solution for device micro-fabrication with best price. Our studies of cutting and drilling with ns, ps, and sub-ps lasers indicate that it is feasible to achieve user accepted quality and speed with cost-effective and reliable laser by optimizing processing conditions.

Paper Details

Date Published: 14 March 2016
PDF: 12 pages
Proc. SPIE 9735, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXI, 973514 (14 March 2016); doi: 10.1117/12.2220264
Show Author Affiliations
Jie Zhang, Advanced Optowave Corp. (United States)
Shenzhen Inno-Laser Technology Co., Ltd. (China)
Sha Tao, Advanced Optowave Corp. (United States)
Shenzhen Inno-Laser Technology Co., Ltd. (China)
Brian Wang, Advanced Optowave Corp. (United States)
Jay Zhao, Advanced Optowave Corp. (United States)
Shenzhen Inno-Laser Technology Co., Ltd. (China)


Published in SPIE Proceedings Vol. 9735:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXI
Beat Neuenschwander; Stephan Roth; Costas P. Grigoropoulos; Tetsuya Makimura, Editor(s)

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