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Proceedings Paper

High-throughput machining using high average power ultrashort pulse lasers and ultrafast polygon scanner
Author(s): Joerg Schille; Lutz Schneider; André Streek; Sascha Kloetzer; Udo Loeschner
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Paper Abstract

In this paper, high-throughput ultrashort pulse laser machining is investigated on various industrial grade metals (Aluminium, Copper, Stainless steel) and Al2O3 ceramic at unprecedented processing speeds. This is achieved by using a high pulse repetition frequency picosecond laser with maximum average output power of 270 W in conjunction with a unique, in-house developed two-axis polygon scanner. Initially, different concepts of polygon scanners are engineered and tested to find out the optimal architecture for ultrafast and precision laser beam scanning. Remarkable 1,000 m/s scan speed is achieved on the substrate, and thanks to the resulting low pulse overlap, thermal accumulation and plasma absorption effects are avoided at up to 20 MHz pulse repetition frequencies. In order to identify optimum processing conditions for efficient high-average power laser machining, the depths of cavities produced under varied parameter settings are analyzed and, from the results obtained, the characteristic removal values are specified. The maximum removal rate is achieved as high as 27.8 mm3/min for Aluminium, 21.4 mm3/min for Copper, 15.3 mm3/min for Stainless steel and 129.1 mm3/min for Al2O3 when full available laser power is irradiated at optimum pulse repetition frequency.

Paper Details

Date Published: 4 March 2016
PDF: 11 pages
Proc. SPIE 9736, Laser-based Micro- and Nanoprocessing X, 97360R (4 March 2016); doi: 10.1117/12.2220112
Show Author Affiliations
Joerg Schille, Hochschule Mittweida (Germany)
Lutz Schneider, Hochschule Mittweida (Germany)
André Streek, Hochschule Mittweida (Germany)
Sascha Kloetzer, Hochschule Mittweida (Germany)
Udo Loeschner, Hochschule Mittweida (Germany)


Published in SPIE Proceedings Vol. 9736:
Laser-based Micro- and Nanoprocessing X
Udo Klotzbach; Kunihiko Washio; Craig B. Arnold, Editor(s)

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