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Proceedings Paper

A novel full chip process window OPC based on matrix retargeting
Author(s): Xima Zhang; Zhitang Yu; Qingwei Liu; Xuan Shen; Liguo Zhang; Le Hong; Vlad Liubich; George Lippincott; Cynthia Zhu; James Word
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Paper Abstract

Process window OPC (PWOPC) is widely used in advanced technology nodes as one of the most important resolution enhancement techniques (RET).1 PWOPC needs to consider not only edge placement error (EPE) from nominal condition simulations, but also constraints based on process variation simulations, such as pinch and bridge related requirements based on process variation band (PVBAND). Those constraints can be challenging to meet as feature size continues to shrink in advanced nodes.

In this paper a novel matrix retargeting based PWOPC was developed to find optimal OPC solutions by solving constraints-based matrix and applying minimal retargeting as needed.2 Experiment results showed enhanced process window and reasonable performance.

Paper Details

Date Published: 15 March 2016
PDF: 8 pages
Proc. SPIE 9780, Optical Microlithography XXIX, 97801C (15 March 2016); doi: 10.1117/12.2219913
Show Author Affiliations
Xima Zhang, Mentor Graphics Corp. (United States)
Zhitang Yu, Mentor Graphics Corp. (United States)
Qingwei Liu, Semiconductor Manufacturing International Corp. (China)
Xuan Shen, Semiconductor Manufacturing International Corp. (China)
Liguo Zhang, Mentor Graphics Shanghai (China)
Le Hong, Mentor Graphics Corp. (United States)
Vlad Liubich, Mentor Graphics Corp. (United States)
George Lippincott, Mentor Graphics Corp. (United States)
Cynthia Zhu, Mentor Graphics Corp. (United States)
James Word, Mentor Graphics Corp. (United States)


Published in SPIE Proceedings Vol. 9780:
Optical Microlithography XXIX
Andreas Erdmann; Jongwook Kye, Editor(s)

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