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Proceedings Paper

Trends in laser micromachining
Author(s): Frank Gaebler; Joris van Nunen; Andrew Held
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Paper Abstract

Laser Micromachining is well established in industry. Depending on the application lasers with pulse length from μseconds to femtoseconds and wavelengths from 1064nm and its harmonics up to 5μm or 10.6μm are used. Ultrafast laser machining using pulses with pico or femtosecond duration pulses is gaining traction, as it offers very precise processing of materials with low thermal impact. Large-scale industrial ultrafast laser applications show that the market can be divided into various sub segments. One set of applications demand low power around 10W, compact footprint and are extremely sensitive to the laser price whilst still demanding 10ps or shorter laser pulses. A second set of applications are very power hungry and only become economically feasible for large scale deployments at power levels in the 100+W class. There is also a growing demand for applications requiring fs-laser pulses. In our presentation we would like to describe these sub segments by using selected applications from the automotive and electronics industry e.g. drilling of gas/diesel injection nozzles, dicing of LED substrates. We close the presentation with an outlook to micromachining applications e.g. glass cutting and foil processing with unique new CO lasers emitting 5μm laser wavelength.

Paper Details

Date Published: 4 March 2016
PDF: 7 pages
Proc. SPIE 9736, Laser-based Micro- and Nanoprocessing X, 973604 (4 March 2016); doi: 10.1117/12.2219749
Show Author Affiliations
Frank Gaebler, Coherent, Inc. (United States)
Joris van Nunen, Coherent, Inc. (United States)
Andrew Held, Coherent, Inc. (United States)


Published in SPIE Proceedings Vol. 9736:
Laser-based Micro- and Nanoprocessing X
Udo Klotzbach; Kunihiko Washio; Craig B. Arnold, Editor(s)

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