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Proceedings Paper

Chemical trimming overcoat: an enhancing composition and process for 193nm lithography
Author(s): Cong Liu; Kevin Rowell; Lori Joesten; Paul Baranowski; Irvinder Kaur; Wanyi Huang; JoAnne Leonard; Hae-Mi Jeong; Kwang-Hwyi Im; Tom Estelle; Charlotte Cutler; Gerd Pohlers; Wenyan Yin; Patricia Fallon; Mingqi Li; Hyun Jeon; Cheng Bai Xu; Pete Trefonas
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Paper Abstract

As the critical dimension of devices is approaching the resolution limit of 193nm photo lithography, multiple patterning processes have been developed to print smaller CD and pitch. Multiple patterning and other advanced lithographic processes often require the formation of isolated features such as lines or posts by direct lithographic printing. The formation of isolated features with an acceptable process window, however, can pose a challenge as a result of poor aerial image contrast at defocus. Herein we report a novel Chemical Trimming Overcoat (CTO) as an extra step after lithography that allows us to achieve smaller feature size and better process window.

Paper Details

Date Published: 25 March 2016
PDF: 10 pages
Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 97791Y (25 March 2016); doi: 10.1117/12.2219688
Show Author Affiliations
Cong Liu, The Dow Chemical Co. (United States)
Kevin Rowell, The Dow Chemical Co. (United States)
Lori Joesten, The Dow Chemical Co. (United States)
Paul Baranowski, The Dow Chemical Co. (United States)
Irvinder Kaur, The Dow Chemical Co. (United States)
Wanyi Huang, The Dow Chemical Co. (United States)
JoAnne Leonard, The Dow Chemical Co. (United States)
Hae-Mi Jeong, The Dow Chemical Co. (United States)
Kwang-Hwyi Im, The Dow Chemical Co. (United States)
Tom Estelle, The Dow Chemical Co. (United States)
Charlotte Cutler, The Dow Chemical Co. (United States)
Gerd Pohlers, The Dow Chemical Co. (United States)
Wenyan Yin, The Dow Chemical Co. (United States)
Patricia Fallon, The Dow Chemical Co. (United States)
Mingqi Li, The Dow Chemical Co. (United States)
Hyun Jeon, The Dow Chemical Co. (United States)
Cheng Bai Xu, The Dow Chemical Co. (United States)
Pete Trefonas, The Dow Chemical Co. (United States)


Published in SPIE Proceedings Vol. 9779:
Advances in Patterning Materials and Processes XXXIII
Christoph K. Hohle; Rick Uchida, Editor(s)

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