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Proceedings Paper

Root cause analysis of overlay metrology excursions with scatterometry overlay technology (SCOL)
Author(s): Karsten Gutjahr; Dongsuk Park; Yue Zhou; Winston Cho; Ki Cheol Ahn; Patrick Snow; Richard McGowan; Tal Marciano; Vidya Ramanathan; Pedro Herrera; Tal Itzkovich; Janay Camp; Michael Adel
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Paper Abstract

We demonstrate a novel method to establish a root cause for an overlay excursion using optical Scatterometry metrology. Scatterometry overlay metrology consists of four cells (two per directions) of grating on grating structures that are illuminated with a laser and diffracted orders measured in the pupil plane within a certain range of aperture. State of art algorithms permit, with symmetric considerations over the targets, to extract the overlay between the two gratings. We exploit the optical properties of the target to extract further information from the measured pupil images, particularly information that maybe related to any change in the process that may lead to an overlay excursion. Root Cause Analysis or RCA is being developed to identify different kinds of process variations (either within the wafer, or between different wafers) that may indicate overlay excursions. In this manuscript, we demonstrate a collaboration between Globalfoundries and KLA-Tencor to identify a symmetric process variation using scatterometry overlay metrology and RCA technique.

Paper Details

Date Published: 24 March 2016
PDF: 10 pages
Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97781M (24 March 2016); doi: 10.1117/12.2219668
Show Author Affiliations
Karsten Gutjahr, GLOBALFOUNDRIES (United States)
Dongsuk Park, GLOBALFOUNDRIES (United States)
Yue Zhou, GLOBALFOUNDRIES (United States)
Winston Cho, GLOBALFOUNDRIES (United States)
Ki Cheol Ahn, GLOBALFOUNDRIES (United States)
Patrick Snow, GLOBALFOUNDRIES (United States)
Richard McGowan, GLOBALFOUNDRIES (United States)
Tal Marciano, KLA-Tencor Corp. (United States)
Vidya Ramanathan, KLA-Tencor Corp. (United States)
Pedro Herrera, KLA-Tencor Corp. (United States)
Tal Itzkovich, KLA-Tencor Corp. (United States)
Janay Camp, KLA-Tencor Corp. (United States)
Michael Adel, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 9778:
Metrology, Inspection, and Process Control for Microlithography XXX
Martha I. Sanchez, Editor(s)

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