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Proceedings Paper

High chi block copolymer DSA to improve pattern quality for FinFET device fabrication
Author(s): HsinYu Tsai; Hiroyuki Miyazoe; Ankit Vora; Teddie Magbitang; Noel Arellano; Chi-Chun Liu; Michael J. Maher; William J. Durand; Simon J. Dawes; James J. Bucchignano; Lynne Gignac; Daniel P. Sanders; Eric A. Joseph; Matthew E. Colburn; C. Grant Willson; Christopher J. Ellison; Michael A. Guillorn
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Paper Abstract

Directed self-assembly (DSA) with block-copolymers (BCP) is a promising lithography extension technique to scale below 30nm pitch with 193i lithography. Continued scaling toward 20nm pitch or below will require material system improvements from PS-b-PMMA. Pattern quality for DSA features, such as line edge roughness (LER), line width roughness (LWR), size uniformity, and placement, is key to DSA manufacturability. In this work, we demonstrate finFET devices fabricated with DSA-patterned fins and compare several BCP systems for continued pitch scaling. Organic-organic high chi BCPs at 24nm and 21nm pitches show improved low to mid-frequency LER/LWR after pattern transfer.

Paper Details

Date Published: 25 March 2016
PDF: 7 pages
Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 977910 (25 March 2016); doi: 10.1117/12.2219544
Show Author Affiliations
HsinYu Tsai, IBM T. J. Watson Research Ctr. (United States)
Hiroyuki Miyazoe, IBM T. J. Watson Research Ctr. (United States)
Ankit Vora, IBM Research Almaden (United States)
Teddie Magbitang, IBM Research Almaden (United States)
Noel Arellano, IBM Research Almaden (United States)
Chi-Chun Liu, IBM Albany NanoTech (United States)
Michael J. Maher, The Univ. of Texas at Austin (United States)
William J. Durand, The Univ. of Texas at Austin (United States)
Simon J. Dawes, IBM T. J. Watson Research Ctr. (United States)
James J. Bucchignano, IBM T. J. Watson Research Ctr. (United States)
Lynne Gignac, IBM T. J. Watson Research Ctr. (United States)
Daniel P. Sanders, IBM Research Almaden (United States)
Eric A. Joseph, IBM T. J. Watson Research Ctr. (United States)
Matthew E. Colburn, IBM Albany NanoTech (United States)
C. Grant Willson, The Univ. of Texas at Austin (United States)
Christopher J. Ellison, The Univ. of Texas at Austin (United States)
Michael A. Guillorn, IBM T. J. Watson Research Ctr. (United States)


Published in SPIE Proceedings Vol. 9779:
Advances in Patterning Materials and Processes XXXIII
Christoph K. Hohle; Rick Uchida, Editor(s)

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