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Proceedings Paper

Metal oxide EUV photoresist performance for N7 relevant patterns and processes
Author(s): Jason Stowers; Jeremy Anderson; Brian Cardineau; Benjamin Clark; Peter De Schepper; Joseph Edson; Michael Greer; Kai Jiang; Michael Kocsis; Stephen Meyers; Alan Telecky; Andrew Grenville; Danilo De Simone; Werner Gillijns; Geert Vandenberghe
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Paper Abstract

Inpria continues to leverage novel metal oxide materials to produce high resolution photoresists for EUV lithography with high optical density and etch resistance. Our resists have previously demonstrated 13nm line/space patterns at 35 mJ/cm2, with extendibility to 10nm half-pitch.1 We have continued to improve photospeed and in this work we provide an update on imaging performance. Since practical patterns for EUV layers will be more complicated than line/space patterns, we also expand on our previous work by demonstrating 2D resist performance using N7 (7nm node) contact and block mask patterns on full field scanners. A resist model has been created and using this model comparisons are made between a metal oxide resist and CAR platforms. Based on this physical model, the impact of shot noise is examined in relation to realistic 2D features. Preliminary data on the effect on OPC of using a non-chemically amplified resist are also presented.

Paper Details

Date Published: 25 March 2016
PDF: 10 pages
Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 977904 (25 March 2016); doi: 10.1117/12.2219527
Show Author Affiliations
Jason Stowers, Inpria Corp. (United States)
Jeremy Anderson, Inpria Corp. (United States)
Brian Cardineau, Inpria Corp. (United States)
Benjamin Clark, Inpria Corp. (United States)
Peter De Schepper, Inpria Corp. (United States)
Joseph Edson, Inpria Corp. (United States)
Michael Greer, Inpria Corp. (United States)
Kai Jiang, Inpria Corp. (United States)
Michael Kocsis, Inpria Corp. (United States)
Stephen Meyers, Inpria Corp. (United States)
Alan Telecky, Inpria Corp. (United States)
Andrew Grenville, Inpria Corp. (United States)
Danilo De Simone, IMEC (Belgium)
Werner Gillijns, IMEC (Belgium)
Geert Vandenberghe, IMEC (Belgium)

Published in SPIE Proceedings Vol. 9779:
Advances in Patterning Materials and Processes XXXIII
Christoph K. Hohle; Rick Uchida, Editor(s)

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