Share Email Print
cover

Proceedings Paper

Directed Self Assembly (DSA) compliant flow with immersion lithography: from material to design and patterning
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this paper, we present a DSA compliant flow for contact/via layers with immersion lithography assuming the grapho-epitaxy process for cylinders’ formation. We demonstrate that the DSA technology enablement needs co-optimization among material, design, and lithography. We show that the number of DSA grouping constructs is countable for the gridded-design architecture. We use Template Error Enhancement Factor (TEEF) to choose DSA material, determine grouping design rules, and select the optimum guiding patterns. Our post-pxOPC imaging data shows that it is promising to achieve 2-mask solution with DSA for the contact/via layer using 193i at 5nm node.

Paper Details

Date Published: 22 March 2016
PDF: 11 pages
Proc. SPIE 9777, Alternative Lithographic Technologies VIII, 97770N (22 March 2016); doi: 10.1117/12.2219505
Show Author Affiliations
Yuansheng Ma, Mentor Graphics Corp. (United States)
Yan Wang, GLOBALFOUNDRIES Inc. (United States)
James Word, Mentor Graphics Corp. (United States)
Junjiang Lei, Mentor Graphics Corp. (United States)
Joydeep Mitra, Mentor Graphics Corp. (United States)
J. Andres Torres, Mentor Graphics Corp. (United States)
Le Hong, Mentor Graphics Corp. (United States)
Germain Fenger, Mentor Graphics Corp. (Belgium)
Daman Khaira, Mentor Graphics Corp. (United States)
Moshe Preil, GLOBALFOUNDRIES Inc. (United States)
Lei Yuan, GLOBALFOUNDRIES Inc. (United States)
Jongwook Kye, GLOBALFOUNDRIES Inc. (United States)
Harry J. Levinson, GLOBALFOUNDRIES Inc. (United States)


Published in SPIE Proceedings Vol. 9777:
Alternative Lithographic Technologies VIII
Christopher Bencher, Editor(s)

© SPIE. Terms of Use
Back to Top