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Proceedings Paper

Metal containing material processing on coater/developer system
Author(s): Shinichiro Kawakami; Hiroshi Mizunoura; Koichi Matsunaga; Koichi Hontake; Hiroshi Nakamura; Satoru Shimura; Masashi Enomoto
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Paper Abstract

Challenges of processing metal containing materials need to be addressed in order apply this technology to Behavior of metal containing materials on coater/developer processing including coating process, developer process and tool metal contamination is studied using CLEAN TRACKTM LITHIUS ProTM Z (Tokyo Electron Limited). Through this work, coating uniformity and coating film defectivity were studied. Metal containing material performance was comparable to conventional materials. Especially, new dispense system (NDS) demonstrated up to 80% reduction in coating defect for metal containing materials. As for processed wafer metal contamination, coated wafer metal contamination achieved less than 1.0E10 atoms/cm2 with 3 materials. After develop metal contamination also achieved less than 1.0E10 atoms/cm2 with 2 materials. Furthermore, through the metal defect study, metal residues and metal contamination were reduced by developer rinse optimization.

Paper Details

Date Published: 25 March 2016
PDF: 6 pages
Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 97790H (25 March 2016); doi: 10.1117/12.2219106
Show Author Affiliations
Shinichiro Kawakami, Tokyo Electron Kyushu Ltd. (Japan)
Hiroshi Mizunoura, Tokyo Electron Kyushu Ltd. (Japan)
Koichi Matsunaga, Tokyo Electron Kyushu Ltd. (Japan)
Koichi Hontake, TEL Technology Ctr., America, LLC (United States)
Hiroshi Nakamura, Tokyo Electron Kyushu Ltd. (Japan)
Satoru Shimura, Tokyo Electron Kyushu Ltd. (Japan)
Masashi Enomoto, Tokyo Electron Kyushu Ltd. (Japan)


Published in SPIE Proceedings Vol. 9779:
Advances in Patterning Materials and Processes XXXIII
Christoph K. Hohle; Rick Uchida, Editor(s)

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