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Proceedings Paper

Estimate design sensitivity to process variation for the 14nm node
Author(s): Guillaume Landié; Vincent Farys
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Paper Abstract

Looking for the highest density and best performance, the 14nm technological node saw the development of aggressive designs, with design rules as close as possible to the limit of the process. Edge placement error (EPE) budget is now tighter and Reticle Enhancement Techniques (RET) must take into account the highest number of parameters to be able to get the best printability and guaranty yield requirements. Overlay is a parameter that must be taken into account earlier during the design library development to avoid design structures presenting a high risk of performance failure.

This paper presents a method taking into account the overlay variation and the Resist Image simulation across the process window variation to estimate the design sensitivity to overlay. Areas in the design are classified with specific metrics, from the highest to the lowest overlay sensitivity. This classification can be used to evaluate the robustness of a full chip product to process variability or to work with designers during the design library development. The ultimate goal is to evaluate critical structures in different contexts and report the most critical ones.

In this paper, we study layers interacting together, such as Contact/Poly area overlap or Contact/Active distance. ASML-Brion tooling allowed simulating the different resist contours and applying the overlay value to one of the layers. Lithography Manufacturability Check (LMC) detectors are then set to extract the desired values for analysis.

Two different approaches have been investigated. The first one is a systematic overlay where we apply the same overlay everywhere on the design. The second one is using a real overlay map which has been measured and applied to the LMC tools. The data are then post-processed and compared to the design target to create a classification and show the error distribution. Figure:

Paper Details

Date Published: 16 March 2016
PDF: 8 pages
Proc. SPIE 9781, Design-Process-Technology Co-optimization for Manufacturability X, 97810U (16 March 2016); doi: 10.1117/12.2219067
Show Author Affiliations
Guillaume Landié, STMicroelectronics (France)
Vincent Farys, STMicroelectronics (France)


Published in SPIE Proceedings Vol. 9781:
Design-Process-Technology Co-optimization for Manufacturability X
Luigi Capodieci, Editor(s)

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