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Proceedings Paper

In-depth analysis of sampling optimization methods
Author(s): Honggoo Lee; Sangjun Han; Myoungsoo Kim; Boris Habets; Stefan Buhl; Steffen Guhlemann; Martin Rößiger; Enrico Bellmann; Seop Kim
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Paper Abstract

High order overlay and alignment models require good coverage of overlay or alignment marks on the wafer. But dense sampling plans are not possible for throughput reasons. Therefore, sampling plan optimization has become a key issue. We analyze the different methods for sampling optimization and discuss the different knobs to fine-tune the methods to constraints of high volume manufacturing. We propose a method to judge sampling plan quality with respect to overlay performance, run-to-run stability and dispositioning criteria using a number of use cases from the most advanced lithography processes.

Paper Details

Date Published: 8 March 2016
PDF: 20 pages
Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97781E (8 March 2016); doi: 10.1117/12.2219037
Show Author Affiliations
Honggoo Lee, SK Hynix R3 (Korea, Republic of)
Sangjun Han, SK Hynix R3 (Korea, Republic of)
Myoungsoo Kim, Korea Univ. (Korea, Republic of)
Boris Habets, Qoniac GmbH (Germany)
Stefan Buhl, Qoniac GmbH (Germany)
Steffen Guhlemann, Qoniac GmbH (Germany)
Martin Rößiger, Qoniac GmbH (Germany)
Enrico Bellmann, Qoniac GmbH (Germany)
Seop Kim, Qoniac Korea Co., Ltd. (Korea, Republic of)


Published in SPIE Proceedings Vol. 9778:
Metrology, Inspection, and Process Control for Microlithography XXX
Martha I. Sanchez, Editor(s)

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