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Proceedings Paper

Study of design-based e-beam defect inspection for hotspot detection and process window characterization on 10nm logic device
Author(s): Philippe Leray; Sandip Halder; Paolo Di Lorenzo; Fei Wang; Pengcheng Zhang; Wei Fang; Kevin Liu; Jack Jau
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Paper Abstract

With the continuous shrink of design rules from 14nm to 10nm to 7nm, conserving process windows in a high volume manufacturing environment is becoming more and more difficult. Masks, scanners, and etch processes have to meet very tight specifications in order to keep defect, CD, as well as overlay within the margins of the process window. In this work, we study a design-based e-beam defect inspection technology for wafer level process window characterization and intra-field defect variability on 10nm logic devices. Due to high resolution, e-beam technology is the natural choice for review and/or detection of subtle pattern deviations, aka defects. The capability of integrating design information (GDS file) with defect detection, dimension measurement of critical structure, and defect classification provides added values for engineers to identify yield limiting systematic defects and to provide feedback to design.

Paper Details

Date Published: 21 April 2016
PDF: 7 pages
Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97780O (21 April 2016); doi: 10.1117/12.2218971
Show Author Affiliations
Philippe Leray, IMEC (Belgium)
Sandip Halder, IMEC (Belgium)
Paolo Di Lorenzo, IMEC (Belgium)
Fei Wang, Hermes Microvision Inc. (United States)
Pengcheng Zhang, Hermes Microvision Inc. (United States)
Wei Fang, Hermes Microvision Inc. (United States)
Kevin Liu, Hermes Microvision Inc. (United States)
Jack Jau, Hermes Microvision Inc. (United States)


Published in SPIE Proceedings Vol. 9778:
Metrology, Inspection, and Process Control for Microlithography XXX
Martha I. Sanchez, Editor(s)

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