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Proceedings Paper

High speed AFM studies of 193 nm immersion photoresists during TMAH development
Author(s): Johnpeter Ngunjiri; Greg Meyers; Jim Cameron; Yasuhiro Suzuki; Hyun Jeon; Dave Lee; Kwang Mo Choi; Jung Woo Kim; Kwang-Hwyi Im; Hae-Jin Lim
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Paper Abstract

In this paper we report on our studies of the dynamic process of resist development in real time. Using High Speed – Atomic Force Microscopy (HS-AFM) in dilute developer solution, changes in morphology and nanomechanical properties of patterned resist were monitored. The Bruker Dimension FastScan AFMTM was applied to analyze 193 nm acrylic-based immersion resists in developer. HS-AFM operated in Peak Force mapping mode allowed for concurrent measurements of image topography resist stiffness, adhesion to AFM probe and deformation during development. In our studies we focused on HS-AFM topography data as it readily revealed detailed information about initial resist morphology, followed by a resist swelling process and eventual dissolution of the exposed resist areas. HS-AFM showed potential for tracking and understanding development of patterned resist films and can be useful in evaluating the dissolution properties of different resist designs.

Paper Details

Date Published: 21 March 2016
PDF: 14 pages
Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 97790W (21 March 2016); doi: 10.1117/12.2218956
Show Author Affiliations
Johnpeter Ngunjiri, Dow Analytical Sciences (United States)
Greg Meyers, Dow Analytical Sciences (United States)
Jim Cameron, Dow Electronic Materials (United States)
Yasuhiro Suzuki, Dow Seoul Technology Ctr. (Korea, Republic of)
Hyun Jeon, Dow Seoul Technology Ctr. (Korea, Republic of)
Dave Lee, Dow Seoul Technology Ctr. (Korea, Republic of)
Kwang Mo Choi, Dow Seoul Technology Ctr. (Korea, Republic of)
Jung Woo Kim, Dow Seoul Technology Ctr. (Korea, Republic of)
Kwang-Hwyi Im, Dow Seoul Technology Ctr. (Korea, Republic of)
Hae-Jin Lim, Dow Seoul Technology Ctr. (Korea, Republic of)


Published in SPIE Proceedings Vol. 9779:
Advances in Patterning Materials and Processes XXXIII
Christoph K. Hohle; Rick Uchida, Editor(s)

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