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Proceedings Paper

Enhancing the Novolak resin resist resolution by adding phenol to fractionated resin
Author(s): Atsushi Sekiguchi; Yoko Matsumoto; Hatsuyuki Tanaka; Toshiyuki Horiuchi; Yoshihisa Sensu; Satoshi Takei; Makoto Hanabata
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Paper Abstract

Novolak resists have been widely used in IC production and are still used in the production of flat panel displays (FPDs) and MEMS. However, with the advent of high-definition products, FPDs increasingly face requirements for finer dimensions. These trends have generated requirements for higher sensitivity, higher resolution, and wider process margin for novolak resists. Using a lithography simulator with the goal of improving the performance of novolak resists, we examined various approaches to improving resist materials. This report discusses efforts to improve resolution and sensitivity using highly fractionated novolak resins and adding low molecular weight phenol resins.

Paper Details

Date Published: 25 March 2016
PDF: 18 pages
Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 97791L (25 March 2016); doi: 10.1117/12.2218948
Show Author Affiliations
Atsushi Sekiguchi, Litho Tech Japan Co., Ltd. (Japan)
Yoko Matsumoto, Litho Tech Japan Co., Ltd. (Japan)
Hatsuyuki Tanaka, Merck Performance Materials Manufacturing G.K. (Japan)
Toshiyuki Horiuchi, Tokyo Denki Univ. (Japan)
Yoshihisa Sensu, Litho Tech Japan Co., Ltd. (Japan)
Satoshi Takei, Toyama Prefectural Univ. (Japan)
Makoto Hanabata, Toyama Prefectural Univ. (Japan)

Published in SPIE Proceedings Vol. 9779:
Advances in Patterning Materials and Processes XXXIII
Christoph K. Hohle; Rick Uchida, Editor(s)

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