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Proceedings Paper

Challenges for immersion lithography extension based on negative tone imaging (NTI) process
Author(s): Michihiro Shirakawa; Tadashi Omatsu; Keiyu Ou; Yasunori Yonekuta; Naoya Hatakeyama; Daisuke Asakawa; Takashi Yakushiji; Mitsuhiro Fujita; Nanae Muraki
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Paper Abstract

Negative tone imaging (NTI) process is a method for obtaining a negative-tone reversal pattern by developing with an organic solvent. As NTI process can break-through the resolution limit of a conventional positive tone development (PTD) process at specific pattern such as trenches and contact holes, it have been applied for a mass production in 20nm and 14nm nodes devices. In NTI system, because a developer is changed from a hydrophilic aqueous solution to a hydrophobic organic solvent, it is possible to review the common resist stack which is optimized for a PTD process. In this paper, we examined the possibility of a bi-layer process using a Si-containing NTI resist. Etching selectivity between the Si-NTI resist and a SOC improved by raising Si-content of the Si-NTI resist, but resolution deteriorates as a trade-off. By suppressing swelling behavior of the Si-NTI resist with a polymer structure control, we overcame this trade-off. As a result, in sub-90 nm pitch L/S and CH patterns, the resolution of the Si-NTI resist achieved comparable level to a conventional NTI resist. In addition, SOC etching was successfully carried out by using the Si-NTI resist pattern as an etching hard mask.

Paper Details

Date Published: 25 March 2016
PDF: 7 pages
Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 97790O (25 March 2016); doi: 10.1117/12.2218939
Show Author Affiliations
Michihiro Shirakawa, FUJIFILM Corp. (Japan)
Tadashi Omatsu, FUJIFILM Corp. (Japan)
Keiyu Ou, FUJIFILM Corp. (Japan)
Yasunori Yonekuta, FUJIFILM Corp. (Japan)
Naoya Hatakeyama, FUJIFILM Corp. (Japan)
Daisuke Asakawa, FUJIFILM Corp. (Japan)
Takashi Yakushiji, FUJIFILM Corp. (Japan)
Mitsuhiro Fujita, FUJIFILM Corp. (Japan)
Nanae Muraki, FUJIFILM Corp. (Japan)

Published in SPIE Proceedings Vol. 9779:
Advances in Patterning Materials and Processes XXXIII
Christoph K. Hohle; Rick Uchida, Editor(s)

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