Share Email Print
cover

Proceedings Paper

Enhacement of intrafield overlay using a design based metrology system
Author(s): Gyoyeon Jo; Sunkeun Ji; Shinyoung Kim; Hyunwoo Kang; Minwoo Park; Sangwoo Kim; Jungchan Kim; Chanha Park; Hyunjo Yang; Kotaro Maruyama; Byungjun Park
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

As the scales of the semiconductor devices continue to shrink, accurate measurement and control of the overlay have been emphasized for securing more overlay margin. Conventional overlay analysis methods are based on the optical measurement of the overlay mark. However, the overlay data obtained from these optical methods cannot represent the exact misregistration between two layers at the circuit level. The overlay mismatch may arise from the size or pitch difference between the overlay mark and the real pattern. Pattern distortion, caused by CMP or etching, could be a source of the overlay mismatch as well. Another issue is the overlay variation in the real circuit pattern which varies depending on its location. The optical overlay measurement methods, such as IBO and DBO that use overlay mark on the scribeline, are not capable of defining the exact overlay values of the real circuit. Therefore, the overlay values of the real circuit need to be extracted to integrate the semiconductor device properly. The circuit level overlay measurement using CDSEM is time-consuming in extracting enough data to indicate overall trend of the chip. However DBM tool is able to derive sufficient data to display overlay tendency of the real circuit region with high repeatability. An E-beam based DBM(Design Based Metrology) tool can be an alternative overlay measurement method.

In this paper, we are going to certify that the overlay values extracted from optical measurement cannot represent the circuit level overlay values. We will also demonstrate the possibility to correct misregistration between two layers using the overlay data obtained from the DBM system.

Paper Details

Date Published: 24 March 2016
PDF: 7 pages
Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97781J (24 March 2016); doi: 10.1117/12.2218937
Show Author Affiliations
Gyoyeon Jo, SK Hynix Inc. (Korea, Republic of)
Sunkeun Ji, SK Hynix Inc. (Korea, Republic of)
Shinyoung Kim, SK Hynix Inc. (Korea, Republic of)
Hyunwoo Kang, SK Hynix Inc. (Korea, Republic of)
Minwoo Park, SK Hynix Inc. (Korea, Republic of)
Sangwoo Kim, SK Hynix Inc. (Korea, Republic of)
Jungchan Kim, SK Hynix Inc. (Korea, Republic of)
Chanha Park, SK Hynix Inc. (Korea, Republic of)
Hyunjo Yang, SK Hynix Inc. (Korea, Republic of)
Kotaro Maruyama, NGR Inc. (Japan)
Byungjun Park, NGR Inc. (Japan)


Published in SPIE Proceedings Vol. 9778:
Metrology, Inspection, and Process Control for Microlithography XXX
Martha I. Sanchez, Editor(s)

© SPIE. Terms of Use
Back to Top