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Proceedings Paper

Novel high sensitivity EUV photoresist for sub-7nm node
Author(s): Tomoki Nagai; Hisashi Nakagawa; Takehiko Naruoka; Seiichi Tagawa; Akihiro Oshima; Seiji Nagahara; Gosuke Shiraishi; Kosuke Yoshihara; Yuichi Terashita; Yukie Minekawa; Elizabeth Buitrago; Yasin Ekinci; Oktay Yildirim; Marieke Meeuwissen; Rik Hoefnagels; Gijsbert Rispens; Coen Verspaget; Raymond Maas
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Paper Abstract

Extreme ultraviolet lithography (EUVL) has been recognized as the most promising candidate for the manufacture of semiconductor devices for the 7 nm node and beyond. A key point in the successful introduction of EUV lithography in high volume manufacture (HVM) is the effective EUV dose utilization while simultaneously realizing ultra-high resolution and low line edge roughness (LER). Here we show EUV resist sensitivity improvement with the use of a photosensitized chemically amplified resist PSCARTM system. The evaluation of this new chemically amplified resist (CAR) as performed using EUV interference lithography (EUV-IL) is described and the fundamentals are discussed.

Paper Details

Date Published: 25 March 2016
PDF: 7 pages
Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 977908 (25 March 2016); doi: 10.1117/12.2218936
Show Author Affiliations
Tomoki Nagai, JSR Corp. (Japan)
Hisashi Nakagawa, JSR Corp. (Japan)
Takehiko Naruoka, JSR Corp. (Japan)
Seiichi Tagawa, Osaka Univ. (Japan)
Akihiro Oshima, Osaka Univ. (Japan)
Seiji Nagahara, Tokyo Electron Ltd. (Japan)
Gosuke Shiraishi, Tokyo Electron Kyushu Ltd. (Japan)
Kosuke Yoshihara, Tokyo Electron Kyushu Ltd. (Japan)
Yuichi Terashita, Tokyo Electron Kyushu Ltd. (Japan)
Yukie Minekawa, Tokyo Electron Kyushu Ltd. (Japan)
Elizabeth Buitrago, Paul Scherrer Institute (Switzerland)
Yasin Ekinci, Paul Scherrer Institute (Switzerland)
Oktay Yildirim, ASML Netherlands B.V. (Netherlands)
Marieke Meeuwissen, ASML Netherlands B.V. (Netherlands)
Rik Hoefnagels, ASML Netherlands B.V. (Netherlands)
Gijsbert Rispens, ASML Netherlands B.V. (Netherlands)
Coen Verspaget, ASML Netherlands B.V. (Netherlands)
Raymond Maas, ASML Netherlands B.V. (Netherlands)


Published in SPIE Proceedings Vol. 9779:
Advances in Patterning Materials and Processes XXXIII
Christoph K. Hohle; Rick Uchida, Editor(s)

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