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An evaluation of edge roll off on 28nm FDSOI (fully depleted silicon on insulator) product
Author(s): M. Gatefait; B. Le-Gratiet; C. Prentice; T. Hasan
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Paper Abstract

On product wafers, scanner focus is better controlled at the wafer center than at the wafer edge. This is due, in a large part, to edge roll off effects [1]. This paper quantifies the impact of edge roll off on scanner levelling non-correctable errors and correlates this to on-product effects. The main contributors and mitigation methods are also discussed for a NXT:1950 scanner.

Paper Details

Date Published: 24 March 2016
PDF: 10 pages
Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97782Y (24 March 2016); doi: 10.1117/12.2218859
Show Author Affiliations
M. Gatefait, STMicroelectronics (France)
B. Le-Gratiet, STMicroelectronics (France)
C. Prentice, ASML SARL (France)
T. Hasan, ASML (Netherlands)

Published in SPIE Proceedings Vol. 9778:
Metrology, Inspection, and Process Control for Microlithography XXX
Martha I. Sanchez, Editor(s)

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