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Proceedings Paper

Smart patch integration development of compression connector structural health monitoring in overhead transmission lines
Author(s): Hong Wang; Jy-An John Wang; Fei Ren; John Chan
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Paper Abstract

Integration of smart patches into full-tension splice connectors in overhead power transmission lines was investigated. Lead zirconate titanate (PZT) -5A was used as a smart material and an aluminum beam was used as a host structure. Negative electrode termination was examined by using copper adhesive tape and direct bonding methods. Various commercial adhesives were studied for PZT integration onto the host structure. Aluminum beam specimens with integrated PZT smart patches were tested under thermal cycling at a temperature of 125°C, which is the higher-end temperature experienced by in-service aluminum conductor steel-reinforced cables. Electromechanical impedance (EMI) measurements were conducted at room temperature, and the root mean square deviation (RMSD) of the conductance signals was used to analyze the EMI data.

It has been shown that the negative electrode method has an important effect on the performance of the integrated PZT. The PZT displayed more susceptibility to cracking when copper tape was used than when direct bonding was used. The reliability of PZT in direct bonding depended on the adhesives used in bonding layers. Although a hard alumina–based adhesive can lead to cracking of the PZT, a high-temperature epoxy with adequate flexibility, such as Duralco 4538D, can provide the desired performance under target thermal cycling conditions. The RMSD parameter can characterize conductance signatures effectively. It also was demonstrated that RMSD can be used to quantify the fatigue of the PZT integration system, although RMSD is used primarily as a damage index in monitoring structural health.

Paper Details

Date Published: 1 April 2016
PDF: 11 pages
Proc. SPIE 9806, Smart Materials and Nondestructive Evaluation for Energy Systems 2016, 980606 (1 April 2016); doi: 10.1117/12.2218669
Show Author Affiliations
Hong Wang, Oak Ridge National Lab. (United States)
Jy-An John Wang, Oak Ridge National Lab. (United States)
Fei Ren, Temple Univ. (United States)
John Chan, Electric Power Research Institute (United States)


Published in SPIE Proceedings Vol. 9806:
Smart Materials and Nondestructive Evaluation for Energy Systems 2016
Norbert G. Meyendorf; Theodoros E. Matikas; Kara J. Peters, Editor(s)

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