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Proceedings Paper

Thermal stress characterization using the impedance-based structural health monitoring system
Author(s): Xuan Zhu; Francesco Lanza di Scalea; Mahmood Fateh
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Paper Abstract

Structural health monitoring (SHM) has attracted researchers’ interests for the past two decades to reinforce the maintenance of the aging infrastructure systems all over the world. As one of the potential solutions, the electro-mechanical impedance (EMI) method was introduced in the early 1990s and has a great number of potential applications in the SHM of civil, mechanical and aerospace industries. This paper studied the impedance-based technique with the presence of environmental/operational variability, especially the influences of temperature and uniaxial stress on the admittance signature-based features. A comprehensive analytical model is established and provides satisfactory agreements with the experimental results. The stress and temperature sensitivities of all the proposed features are quantified using the experimental measurements, with discussions on their advantages and disadvantages. The final results illustrate that the EMI method can potentially provide effective measure for thermal stress.

Paper Details

Date Published: 15 April 2016
PDF: 16 pages
Proc. SPIE 9799, Active and Passive Smart Structures and Integrated Systems 2016, 97990B (15 April 2016); doi: 10.1117/12.2218544
Show Author Affiliations
Xuan Zhu, Univ. of California, San Diego (United States)
Francesco Lanza di Scalea, Univ. of California, San Diego (United States)
Mahmood Fateh, Federal Railroad Administration (United States)


Published in SPIE Proceedings Vol. 9799:
Active and Passive Smart Structures and Integrated Systems 2016
Gyuhae Park, Editor(s)

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