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Proceedings Paper

Polishing performances of different optics with different size powder and different pH value slurries during CMP polishing
Author(s): Jun Cao; Chaoyang Wei; Shijie Liu; Aihuan Dun; Minghong Yang; Xueke Xu; Jianda Shao
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Paper Abstract

Different size polishing powder and different pH value ceria slurries were used to polish fused silica glass、K9 glass and Nd-doped glass on pitch plate. Material removal rates (MRR) of glass polished with different size powder and various pH value slurries, and textures of each sample were characterized. The results show that powder size has an effect on glass polishing performance: scratch densities increase with the increase of polishing powder size; surface textures become rougher with the increase of the size of polishing powder. The slurry pH value also affects glass polishing performance: MRR of fused silica glass are lowest under any pH value slurry while Nd-doped glass has the largest MRR; removal rates of all three kinds of glass will rise under both acidic and alkaline condition. Near neutral polishing environment and smaller size powder are useful for the surface polishing process. The results further reveal polishing mechanism and provide the guidance for glass surface process.

Paper Details

Date Published: 12 October 2015
PDF: 10 pages
Proc. SPIE 9633, Optifab 2015, 96332O (12 October 2015); doi: 10.1117/12.2218455
Show Author Affiliations
Jun Cao, Shanghai Institute of Optics and Fine Mechanics (China)
Chaoyang Wei, Shanghai Institute of Optics and Fine Mechanics (China)
Shijie Liu, Shanghai Institute of Optics and Fine Mechanics (China)
Aihuan Dun, Shanghai Institute of Optics and Fine Mechanics (China)
Minghong Yang, Shanghai Institute of Optics and Fine Mechanics (China)
Xueke Xu, Shanghai Institute of Optics and Fine Mechanics (China)
Jianda Shao, Shanghai Institute of Optics and Fine Mechanics (China)


Published in SPIE Proceedings Vol. 9633:
Optifab 2015
Julie L. Bentley; Sebastian Stoebenau, Editor(s)

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