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Proceedings Paper

The influence of ArF excimer laser micromachining on physicochemical properties of bioresorbable poly(L-lactide)
Author(s): Bogusz D. Stępak; Arkadiusz J. Antończak; Konrad Szustakiewicz; Celina Pezowicz; Krzysztof M. Abramski
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Paper Abstract

The main advantage of laser processing is a non-contact character of material removal and high precision attainable thanks to low laser beam dimensions. This technique enables forming a complex, submillimeter geometrical shapes such as vascular stents which cannot be manufactured using traditional techniques e.g. injection moulding or mechanical treatment. In the domain of nanosecond laser sources, an ArF excimer laser appears as a good candidate for laser micromachining of bioresorbable polymers such as poly(L-lactide). Due to long pulse duration, however, there is a risk of heat diffusion and accumulation in the material. In addition, due to short wavelength (193 nm) photochemical process can modify the chemical composition of ablated surfaces. The motivation for this research was to evaluate the influence of laser micromachining on physicochemical properties of poly(L-lactide). We performed calorimetric analysis of laser machined samples by using differential scanning calorimetry (DSC). It allowed us to find the optimal process parameters for heat affected zone (HAZ) reduction. The chemical composition of the ablated surface was investigated by FTIR in attenuated total reflectance (ATR) mode.

Paper Details

Date Published: 4 March 2016
PDF: 8 pages
Proc. SPIE 9736, Laser-based Micro- and Nanoprocessing X, 97361T (4 March 2016); doi: 10.1117/12.2218380
Show Author Affiliations
Bogusz D. Stępak, Wroclaw Univ. of Technology (Poland)
Arkadiusz J. Antończak, Wroclaw Univ. of Technology (Poland)
Konrad Szustakiewicz, Wroclaw Univ. of Technology (Poland)
Celina Pezowicz, Wroclaw Univ. of Technology (Poland)
Krzysztof M. Abramski, Wroclaw Univ. of Technology (Poland)

Published in SPIE Proceedings Vol. 9736:
Laser-based Micro- and Nanoprocessing X
Udo Klotzbach; Kunihiko Washio; Craig B. Arnold, Editor(s)

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