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Proceedings Paper

Directed self-assembly of Si-containing and topcoat free block copolymer
Author(s): Tasuku Matsumiya; Takehiro Seshimo; Tsuyoshi Kurosawa; Hitoshi Yamano; Ken Miyagi; Tomotaka Yamada; Katsumi Ohmori
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Paper Abstract

Directed self-assembly (DSA) of block copolymers (BCPs) with conventional lithography is being thought as one of the potential patterning solution for future generation devices manufacturing. New BCP platform is required to obtain resolution below 10nm half pitch (HP), better roughness, and defect characteristics than PS-b-PMMA. In this study, we will introduce the newly developed Si-containing high chi BCP which can apply perpendicular lamellar orientation with topcoat free, mild thermal annealing under nitrogen process conditions. It will be also shown in experimental results of graphoepitaxy demonstration for L/S multiplication using new high chi BCP.

Paper Details

Date Published: 1 April 2016
PDF: 7 pages
Proc. SPIE 9777, Alternative Lithographic Technologies VIII, 97771P (1 April 2016); doi: 10.1117/12.2218243
Show Author Affiliations
Tasuku Matsumiya, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Takehiro Seshimo, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Tsuyoshi Kurosawa, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Hitoshi Yamano, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Ken Miyagi, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Tomotaka Yamada, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Katsumi Ohmori, Tokyo Ohka Kogyo Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 9777:
Alternative Lithographic Technologies VIII
Christopher Bencher, Editor(s)

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