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Proceedings Paper

Sensors, nano-electronics and photonics for the Army of 2030 and beyond
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Paper Abstract

The US Army’s future operating concept will rely heavily on sensors, nano-electronics and photonics technologies to rapidly develop situational understanding in challenging and complex environments. Recent technology breakthroughs in integrated 3D multiscale semiconductor modeling (from atoms-to-sensors), combined with ARL’s Open Campus business model for collaborative research provide a unique opportunity to accelerate the adoption of new technology for reduced size, weight, power, and cost of Army equipment. This paper presents recent research efforts on multi-scale modeling at the US Army Research Laboratory (ARL) and proposes the establishment of a modeling consortium or center for semiconductor materials modeling. ARL’s proposed Center for Semiconductor Materials Modeling brings together government, academia, and industry in a collaborative fashion to continuously push semiconductor research forward for the mutual benefit of all Army partners.

Paper Details

Date Published: 13 February 2016
PDF: 8 pages
Proc. SPIE 9755, Quantum Sensing and Nano Electronics and Photonics XIII, 975506 (13 February 2016); doi: 10.1117/12.2217797
Show Author Affiliations
Philip Perconti, U.S. Army Research Lab. (United States)
W. C. Kirkpatrick Alberts, U.S. Army Research Lab. (United States)
Jagmohan Bajaj, U.S. Army Research Lab. (United States)
Jonathan Schuster, U.S. Army Research Lab. (United States)
Meredith Reed, U.S. Army Research Lab. (United States)


Published in SPIE Proceedings Vol. 9755:
Quantum Sensing and Nano Electronics and Photonics XIII
Manijeh Razeghi, Editor(s)

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