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Proceedings Paper

Optical interconnect technologies for high-bandwidth ICT systems
Author(s): Norio Chujo; Toshiaki Takai; Akiko Mizushima; Hideo Arimoto; Yasunobu Matsuoka; Hiroki Yamashita; Naoki Matsushima
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Paper Abstract

The bandwidth of information and communication technology (ICT) systems is increasing and is predicted to reach more than 10 Tb/s. However, an electrical interconnect cannot achieve such bandwidth because of its density limits. To solve this problem, we propose two types of high-density optical fiber wiring for backplanes and circuit boards such as interface boards and switch boards. One type uses routed ribbon fiber in a circuit board because it has the ability to be formed into complex shapes to avoid interfering with the LSI and electrical components on the board. The backplane is required to exhibit high density and flexibility, so the second type uses loose fiber. We developed a 9.6-Tb/s optical interconnect demonstration system using embedded optical modules, optical backplane, and optical connector in a network apparatus chassis. We achieved 25-Gb/s transmission between FPGAs via the optical backplane.

Paper Details

Date Published: 7 March 2016
PDF: 6 pages
Proc. SPIE 9775, Next-Generation Optical Networks for Data Centers and Short-Reach Links III, 97750D (7 March 2016); doi: 10.1117/12.2217724
Show Author Affiliations
Norio Chujo, Hitachi, Ltd. (Japan)
Toshiaki Takai, Hitachi, Ltd. (Japan)
Akiko Mizushima, Hitachi, Ltd. (Japan)
Hideo Arimoto, Hitachi, Ltd. (Japan)
Yasunobu Matsuoka, Hitachi, Ltd. (Japan)
Hiroki Yamashita, Hitachi, Ltd. (Japan)
Naoki Matsushima, Hitachi, Ltd. (Japan)


Published in SPIE Proceedings Vol. 9775:
Next-Generation Optical Networks for Data Centers and Short-Reach Links III
Atul K. Srivastava, Editor(s)

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