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Proceedings Paper

Low latency, area, and energy efficient Hybrid Photonic Plasmonic on-chip Interconnects (HyPPI)
Author(s): Shuai Sun; Abdel-Hameed A. Badaway; Vikram Narayana; Tarek El-Ghazawi; Volker J. Sorger
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Paper Abstract

In this paper we benchmark various interconnect technologies including electrical, photonic, and plasmonic options. We contrast them with hybridizations where we consider plasmonics for active manipulation devices, and photonics for passive propagation integrated circuit elements, and further propose another novel hybrid link that utilizes an on chip laser for intrinsic modulation thus bypassing electro-optic modulation. Link benchmarking proves that hybridization can overcome the shortcomings of both pure photonic and plasmonic links. We show superiority in a variety of performance parameters such as point-to-point latency, energy efficiency, capacity, ability to support wavelength division multiplexing, crosstalk coupling length, bit flow density and Capability-to-Latency-Energy-Area Ratio.

Paper Details

Date Published: 15 March 2016
PDF: 7 pages
Proc. SPIE 9753, Optical Interconnects XVI, 97530A (15 March 2016); doi: 10.1117/12.2217284
Show Author Affiliations
Shuai Sun, The George Washington Univ. (United States)
Abdel-Hameed A. Badaway, The George Washington Univ. (United States)
Arkansas Tech Univ. (United States)
Vikram Narayana, The George Washington Univ. (United States)
Tarek El-Ghazawi, The George Washington Univ. (United States)
Volker J. Sorger, The George Washington Univ. (United States)


Published in SPIE Proceedings Vol. 9753:
Optical Interconnects XVI
Henning Schröder; Ray T. Chen, Editor(s)

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