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Proceedings Paper

Tailored femtosecond Bessel beams for high-throughput, taper-free through-silicon vias (TSVs) fabrication
Author(s): Fei He; Junjie Yu; Wei Chu; Zhaohui Wang; Yuanxin Tan; Ya Cheng; Koji Sugioka
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Paper Abstract

For higher-density integration and acceleration of operating speed in Si ICs, 3D integration of wafers and/or dies is essential. Fabrication of current 3D ICs relies on 3D assembly which electrically connects stacked chips to form a single circuit. A key technology for the 3D assembly is TSVs which are vertical electrical connections passing completely through silicon chips to electrically connect vertically assembled Si ICs. Typical TSVs have wide features, with diameters of a range from several microns to 50 μm and depths up to 500 μm with aspect ratios up to 15 depending on the application and integration scheme. In this work, we present high-throughput, taper-free TSVs fabrication using femtosecond Bessel beams operated at different wavelengths from 400 nm to 2.4 μm. Furthermore, special phase filters are designed to suppress the damages induced by the side-lobes of Bessel beams for high-quality TSVs fabrication. Our technique can be potentially used for 3D assembly in manufacture of 3D silicon integrated circuits.

Paper Details

Date Published: 14 March 2016
PDF: 14 pages
Proc. SPIE 9735, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXI, 973506 (14 March 2016); doi: 10.1117/12.2214694
Show Author Affiliations
Fei He, RIKEN Ctr. for Advanced Photonics (Japan)
Shanghai Institute of Optics and Fine Mechanics (China)
Junjie Yu, Shanghai Institute of Optics and Fine Mechanics (China)
Wei Chu, Shanghai Institute of Optics and Fine Mechanics (China)
Zhaohui Wang, Shanghai Institute of Optics and Fine Mechanics (China)
Yuanxin Tan, Shanghai Institute of Optics and Fine Mechanics (China)
Ya Cheng, Shanghai Institute of Optics and Fine Mechanics (China)
Koji Sugioka, RIKEN Ctr. for Advanced Photonics (Japan)


Published in SPIE Proceedings Vol. 9735:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXI
Beat Neuenschwander; Stephan Roth; Costas P. Grigoropoulos; Tetsuya Makimura, Editor(s)

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