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Proceedings Paper

Reduction of post develop residue using optimal developer chemistry and develop/rinse processes
Author(s): George P. Mirth
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Paper Abstract

This paper summarized a collection of work and experimentation on detecting, classifying and reducing post developer defects. Various experiments demonstrate the effects of substrate priming, pH shock at rinse, resist hydrophobicity, rinse methods and developer surfactants in reducing post develop defects.

Paper Details

Date Published: 22 September 1995
PDF: 8 pages
Proc. SPIE 2635, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis, (22 September 1995); doi: 10.1117/12.221453
Show Author Affiliations
George P. Mirth, Shipley Co. Inc. (United States)

Published in SPIE Proceedings Vol. 2635:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis
Gopal Rao; Massimo Piccoli, Editor(s)

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