Share Email Print
cover

Proceedings Paper

High power diode laser array development using completely indium free packaging technology with narrow spectrum
Author(s): Dong Hou; Jingwei Wang; Lijun Gao; Xuejie Liang; Xiaoning Li; Xingsheng Liu
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The high power diode lasers have been widely used in many fields. In this work, a sophisticated high power and high performance horizontal array of diode laser stacks have been developed and fabricated with high duty cycle using hard solder bonding technology. CTE-matched submount and Gold Tin (AuSn) hard solder are used for bonding the diode laser bar to achieve the performances of anti-thermal fatigue, higher reliability and longer lifetime. This array consists of 30 bars with the expected optical output peak power of 6000W. By means of numerical simulation and analytical results, the diode laser bars are aligned on suitable positions along the water cooled cooler in order to achieve the uniform wavelength with narrow spectrum and accurate central wavelength. The performance of the horizontal array, such as output power, spectrum, thermal resistance, life time, etc., is characterized and analyzed.

Paper Details

Date Published: 22 April 2016
PDF: 12 pages
Proc. SPIE 9730, Components and Packaging for Laser Systems II, 973009 (22 April 2016); doi: 10.1117/12.2213928
Show Author Affiliations
Dong Hou, Focuslight Technologies Inc. (China)
Jingwei Wang, Focuslight Technologies Inc. (China)
Lijun Gao, Focuslight Technologies Inc. (China)
Xuejie Liang, Focuslight Technologies Inc. (China)
Xiaoning Li, Focuslight Technologies Inc. (China)
Xingsheng Liu, Focuslight Technologies Inc. (China)
Xi'an Institute of Optics and Precision Mechanics (China)


Published in SPIE Proceedings Vol. 9730:
Components and Packaging for Laser Systems II
Alexei L. Glebov; Paul O. Leisher, Editor(s)

© SPIE. Terms of Use
Back to Top