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Proceedings Paper

Toward designing back-illuminated CMOS image sensor based on 3D modeling
Author(s): Y. G. Xiao; K. Uehara; Y. Fu; M. Lestrade; Z. Q. Li; Y. J. Zhou; Z. M. Simon Li
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Paper Abstract

Three-dimensional (3D) modeling is reported for CMOS active pixel image sensors particularly by comparing front surface and back-surface illumination. The opto-electronic responses are presented versus various power intensity and illumination wavelength. The optical efficiency and quantum efficiency from FDTD modeling are also presented. For appropriately designed sensor structure, it is shown that back-surface illumination pixel could achieve improved sensitivity within certain wavelength range. The presented results demonstrate a methodological and technical capability for 3D modeling optimization of complex CMOS image sensor.

Paper Details

Date Published: 4 March 2016
PDF: 8 pages
Proc. SPIE 9742, Physics and Simulation of Optoelectronic Devices XXIV, 97420A (4 March 2016); doi: 10.1117/12.2213549
Show Author Affiliations
Y. G. Xiao, Crosslight Software Inc. (Canada)
K. Uehara, Crosslight Software Inc. (Canada)
Y. Fu, Crosslight Software Inc. (Canada)
M. Lestrade, Crosslight Software Inc. (Canada)
Z. Q. Li, Crosslight Software Inc. (Canada)
Y. J. Zhou, Crosslight Software Inc. (Canada)
Z. M. Simon Li, Crosslight Software Inc. (Canada)

Published in SPIE Proceedings Vol. 9742:
Physics and Simulation of Optoelectronic Devices XXIV
Bernd Witzigmann; Marek Osiński; Yasuhiko Arakawa, Editor(s)

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