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Proceedings Paper

Silicon photonics for 100 Gbit/s intra-data center optical interconnects
Author(s): Stefan Meister; Moritz Grehn; Hanjo Rhee; Marco Vitali; Christoph Theiss; Sebastian Kupijai; Aws Al-Saadi; Danilo Bronzi; Sven Otte; Marvin Henniges; David Selicke; Muhammad Atif; Erik Schwartz; Stefan Lischke; David Stolarek; Andreas Mai; Mehmet Kaynak; Harald H. Richter; Lars Zimmermann
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Paper Abstract

We report on an ultra-compact co-integrated transmitter and receiver in SiGe BiCMOS technology for short reach optical interconnects. A fully integrated EPIC transceiver chip on silicon photonics technology is described. The chip integrates all photonic and electronic devices for an electro-optic transceiver and has been designed to be testable on wafer-scale. A node-matched diode modulator based on carrier injection is a key building block in the chip design. Its operation performance is presented with respect to insertion loss, signal-to-noise-ratio and power consumption at a 25.78125 Gbit/s in NRZ operation. A novel SiGe based photodetector exhibits a -3 dB bandwidth of up to 70 GHz and a responsivity of >1 A/W. Details are given about the process technology of co-integration of photonic and electronic integrated circuits using both silicon-on-insulator and bulk silicon. The implemented co-integration process requires only few additional process steps, leading to only a slight increase in complexity compared to conventional CMOS and BiCMOS baselines.

Paper Details

Date Published: 15 March 2016
PDF: 7 pages
Proc. SPIE 9753, Optical Interconnects XVI, 975308 (15 March 2016); doi: 10.1117/12.2213386
Show Author Affiliations
Stefan Meister, Technische Univ. Berlin (Germany)
Sicoya GmbH (Germany)
Moritz Grehn, Technische Univ. Berlin (Germany)
Sicoya GmbH (Germany)
Hanjo Rhee, Technische Univ. Berlin (Germany)
Sicoya GmbH (Germany)
Marco Vitali, Technische Univ. Berlin (Germany)
Sicoya GmbH (Germany)
Christoph Theiss, Technische Univ. Berlin (Germany)
Sicoya GmbH (Germany)
Sebastian Kupijai, Technische Univ. Berlin (Germany)
Sicoya GmbH (Germany)
Aws Al-Saadi, Technische Univ. Berlin (Germany)
Sicoya GmbH (Germany)
Danilo Bronzi, Technische Univ. Berlin (Germany)
Sicoya GmbH (Germany)
Sven Otte, Technische Univ. Berlin (Germany)
Sicoya GmbH (Germany)
Marvin Henniges, Technische Univ. Berlin (Germany)
David Selicke, Technische Univ. Berlin (Germany)
Muhammad Atif, Technische Univ. Berlin (Germany)
Erik Schwartz, Technische Univ. Berlin (Germany)
Stefan Lischke, Innovations for High Performance Microelectronics GmbH (Germany)
David Stolarek, Innovations for High Performance Microelectronics GmbH (Germany)
Andreas Mai, Innovations for High Performance Microelectronics GmbH (Germany)
Mehmet Kaynak, Innovations for High Performance Microelectronics GmbH (Germany)
Harald H. Richter, Innovations for High Performance Microelectronics GmbH (Germany)
Lars Zimmermann, Innovations for High Performance Microelectronics GmbH (Germany)


Published in SPIE Proceedings Vol. 9753:
Optical Interconnects XVI
Henning Schröder; Ray T. Chen, Editor(s)

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